Title:
INSPECTION METHOD FOR CHIP
Document Type and Number:
Japanese Patent JP2023110151
Kind Code:
A
Abstract:
To provide an inspection method that makes it possible to properly evaluate chips formed by dividing a workpiece.SOLUTION: The inspection method for chips includes the steps of: dividing a workpiece into a plurality of chips by processing the workpiece under predetermined dividing processing conditions; acquiring a side image representing a side surface of a chip by imaging the side surface of the chip; and inspecting the state of the chip by comparing an evaluation value extracted from the side image with a threshold value.SELECTED DRAWING: Figure 1
Inventors:
KOBAYASHI MAKOTO
UMEHARA OKIJIN
YANO HIROHIDE
MATSUOKA YUYA
UMEHARA OKIJIN
YANO HIROHIDE
MATSUOKA YUYA
Application Number:
JP2022011398A
Publication Date:
August 09, 2023
Filing Date:
January 28, 2022
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/53; G01N21/956; H01L21/66
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato