Title:
INSPECTION OF SECOND BONDING POINT IN WIRE BONDING
Document Type and Number:
Japanese Patent JP3409676
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an inspecting method of second bonding point in wire bonding capable of efficiently performing the inspection of a second bonding with high reliability.
SOLUTION: An image of a bonding point is taken by a camera and stored as an image data. Circular arcs (a), (b) as approximate segments of line of profile lines A, B of a standard crescent are preset, and the circular arcs (a), (b) are rotated on the picture based on the image data according to the wire extension angle α of a bonding point of an object to be inspected, and matched to the crescent profile lines A, B while searching by superposing it on the image of the bonding point. The intersection of the circular arcs (a), (b) is determined after matching to form a reference point for specifying the crescent form, and the bonding state is judged on the basis of the reference point. According to this, the processing time required for the inspection can be significantly shortened.
Inventors:
Hirofumi Matsuzaki
Application Number:
JP1248498A
Publication Date:
May 26, 2003
Filing Date:
January 26, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
G01B11/24; H01L21/60; (IPC1-7): G01B11/24; H01L21/60
Domestic Patent References:
| JP737924A | ||||
| JP763528A | ||||
| JP10173010A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)