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Title:
検査用ウエハ支持装置及び検査用ウエハ支持方法
Document Type and Number:
Japanese Patent JP4175086
Kind Code:
B2
Abstract:
A wafer support device having a fixed base, a guiding device, a movable base disposed so as to move in a vertical direction with respect to the fixed base by the guiding device, a first pressing device pressing the movable base, a theta stage rotatably disposed on the movable base with the vertical direction as a rotation axis, a linear motor, a contact bar, a load control device controlling a load of pressing, and a controller controlling a pressing force by the first pressing device based on the load. The first pressing device has a cylinder and a main pressurizing chamber and a sub-pressurizing chamber, a piston rod vertically moving in the main pressurizing chamber and the sub-pressurizing chamber, respectively, a main pressure controller controlling a pressure in the main pressurizing chamber, and a sub pressure controller controlling a pressure in the sub-pressurizing chamber.

Inventors:
Toshiwage Ogatsu
Application Number:
JP2002315097A
Publication Date:
November 05, 2008
Filing Date:
October 29, 2002
Export Citation:
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Assignee:
NEC
International Classes:
H01L21/66; B23Q1/48; B23Q16/02; B23Q17/00; H01L21/00
Domestic Patent References:
JP6124984A
JP2004063653A
JP2002025903A
JP2002100666A
Foreign References:
WO2002077485A1
Attorney, Agent or Firm:
Masahiko Desk
Akitaka Kimura
Yasuhisa Tanizawa