Title:
INSULATED CURABLE RESIN COMPOSITION AND ITS CURED PRODUCT
Document Type and Number:
Japanese Patent JP2006335807
Kind Code:
A
Abstract:
To provide an insulated resin composition which can be filled with an inorganic filler in a high concentration to easily obtain a low thermal expansion coefficient, high heat conductivity, low water absorption, and the like, can be developed with a diluted alkali aqueous solution, and little releases gasified components from organic components such as a resin at high temperature.
This curable resin composition comprising (A) a carboxy group-containing copolymer resin, (B) a compound having two or more reactive groups curable with active energy rays, (C) a photopolymerization initiator, and (D) an inorganic filler, wherein the content of the inorganic filler (D) is ≥65 mass% in the solid content.
Inventors:
DAIKO YOSHIKAZU
MINEGISHI MASASHI
ITOKAWA GEN
MINEGISHI MASASHI
ITOKAWA GEN
Application Number:
JP2005159607A
Publication Date:
December 14, 2006
Filing Date:
May 31, 2005
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
C08F2/44; C08F265/06; C08F289/00; C08K3/00; C08K5/00; C08L55/00; H05K1/03
Domestic Patent References:
| JP2003270783A | 2003-09-25 | |||
| JP2003281937A | 2003-10-03 | |||
| JP2002371204A | 2002-12-26 |
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