Title:
Insulating attaching structure of a semiconductor device
Document Type and Number:
Japanese Patent JP5986854
Kind Code:
B2
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Inventors:
Takao Aoki
Junji Morikawa
Junji Morikawa
Application Number:
JP2012197285A
Publication Date:
September 06, 2016
Filing Date:
September 07, 2012
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
H01L23/40; H05K7/20
Domestic Patent References:
| JP9298889A | ||||
| JP9139592A | ||||
| JP2009295706A | ||||
| JP201249167A | ||||
| JP1208626A | ||||
| JP6241550A |
Attorney, Agent or Firm:
Noriharu Fujita
Kunio Ueda
Kunio Ueda
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