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Patent Searching and Data


Title:
INSULATING LAYER, METAL WITH RESIN, CARRIER FILM WITH RESIN, AND MULTI-LAYER PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2004291393
Kind Code:
A
Abstract:

To improve dielectric characteristics, crack resistance, and characteristics after high temperature treatment.

An insulating layer is the insulating layer of a laminated plate and composed of a resin composition containing a benzocyclobutene resin and a compound having a bisphenol F structure. Metal foil with a resin has the insulating layer and metal foil. A carrier film with a resin has the insulating layer and a carrier film. A multi-layer printed circuit board is formed by laying the metal foil with the resin etc., on one side or both sides of an inner layer circuit board to overlap each other, and hot-pressing them.


Inventors:
ONOZUKA TAKESHI
Application Number:
JP2003086904A
Publication Date:
October 21, 2004
Filing Date:
March 27, 2003
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B32B27/00; B32B15/08; C08K5/107; C08L65/00; H05K3/46; (IPC1-7): B32B27/00; B32B15/08; C08K5/107; C08L65/00; H05K3/46