Title:
INSULATING RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD AND THE MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2001127441
Kind Code:
A
Abstract:
To provide an insulating resin composition for multilayer printed wiring boards for easily and inexpensively manufacturing the multilayer printed wiring boards having high heat resistance and improved reliability of copper wire adhesion, without excessively applying loads to the environment.
In this insulating resin composition for multilayer printed wiring boards that are made of a multifunctional epoxy compound having at least two constituents and a curing agent, the multifunctional epoxy compound contains the multifunctional epoxy compound in structure to include aromatics having at least three epoxy groups in a single molecule and the multifunctional epoxy compound having at least two epoxy groups in one molecule.
Inventors:
MURATA KOJI
MURAI TOSHIE
KAWAMOTO KENJI
MURAI TOSHIE
KAWAMOTO KENJI
Application Number:
JP30303699A
Publication Date:
May 11, 2001
Filing Date:
October 25, 1999
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H05K3/46; C08L63/00; (IPC1-7): H05K3/46; C08L63/00
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