To provide an insulating resin compound for a multilayer printed wiring board having an excellent heat resistance and a high adhesive strength between an insulation layer and a conductive layer at a low price.
An insulation resin compound for multilayer printed wiring board with polybutadiene C having epoxy equivalent of 150 to 250 and the end group being hydrogen or hydroxyl group, which comprises a bisphenol type epoxy resin compound at least as a photohardening resin, an ultraviolet ray hardening resin A obtained by reaction between a reactant of unsaturated monocarbonic acid and saturated or unsaturated polybasic acid anhydride, a multifunctional epoxy resin B as a thermal hardening component, a polybutadiene C obtained by turning part of double coupling region remaining in molecules, epoxy compound D and photopolymerization initiator E having both the photohardening component and thermo-hardening component, and a filler.
KAWAMOTO KENJI
AKIMOTO SATOSHI
KAWACHI SHINJI
Next Patent: INSULATING RESIN COMPOUND FOR MULTILAYER PRINTED WIRING BOARD