To provide an insulation coating excellent in insulation property and bonding property with a member such as a semiconductor chip, etc., for a long period of time, and also as necessary, easily peelable from the member, a heat-radiating insulation coating excellent in insulation property, heat-radiating property and bonding property with the member such as the semiconductor chip, etc., for a long period of time, and as necessary easily peelable from the member, an electronic part obtained by using such the insulation coating or heat-radiating insulation coating and also the semiconductor device obtained by using the heat-radiating insulation coating.
This insulation coating containing a resin composition having an A-B-A type styrene block copolymer and/or its hydrogenated material, a stickifier resin and solvent is provided by containing 50 to 150 pts.wt. above solvent based on 100 pts.wt. resin composition.
MAENAKA HIROSHI
TANIGAWA MITSURU
AOYAMA TAKUJI
NISHIMURA TAKASHI
Katsutoshi Moroda