Title:
MANUFACTURE OF RESIN BOND WHEEL
Document Type and Number:
Japanese Patent JP3135086
Kind Code:
B2
Abstract:
PURPOSE: To simplify a manufacturing process, to improve productivity, and to increase the fixing force of a grinding grain layer by fixing a grinding grain layer to a base metal simultaneously with formation of the grinding grain layer through pressure heating molding after a mold is filled with the original grains of the grinding grain layer in a state to make contact with the plated layer of the base metal.
CONSTITUTION: A base metal on the surface of which a plated layer is formed is incorporated in a mold. The mold is filled with the original grains of a grinding grain layer containing resin and metallic powder in a state to make contact with the plated layer. Thereafter, simultaneously with formation of a plated layer through pressure heating molding, the plated layer is fixed to the base metal to produce a desired resin bond wheel. In this case, the base metal is made of a metal and the plated layer is a copper-plated layer with a thickness of 5-60μm.
Inventors:
Shigemitsu Tanaka
Tsutomu Takeuchi
Katsuhiro Ishiguro
Tsutomu Takeuchi
Katsuhiro Ishiguro
Application Number:
JP9813092A
Publication Date:
February 13, 2001
Filing Date:
April 17, 1992
Export Citation:
Assignee:
Noritake Diamond Co., Ltd.
International Classes:
B24D3/00; B24D3/28; (IPC1-7): B24D3/28; B24D3/00
Domestic Patent References:
| JP6165777A | ||||
| JP3149185A |
Attorney, Agent or Firm:
Masashi Kobori