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Title:
INTEGRATED FLUID SUPPLYING DEVICE, SEAL MATERIAL USED IN IT, AND SEMICONDUCTOR MANUFACTURING DEVICE FITTED THEREWITH
Document Type and Number:
Japanese Patent JP2002130479
Kind Code:
A
Abstract:

To provide an integrated fluid supplying device of such a configuration that a plurality of fluid treatment devices are connected by a passage block to allow flowing of the fluid and also provide a seal material and a semiconductor manufacturing device, wherein fluid treatment devices having different seal structures are made connectable with the passage block.

The integrated fluid supplying device is composed of a plurality of gas treatment devices 40 to make a specified treatment to a semiconductor manufacturing gas supplied through a device side connecting hole 43 formed in a device side seal surface 44, a base block 30 having a block side connecting hole 47 in a block side seal surface 48 and installed in the lower parts of the gas treatment devices 40 for putting adjoining gas treatment devices 40 in mutual communication, and seal material 50A interposed between the device side connecting hole 43 and block side connecting hole 47 for sealing the connecting position between each gas treatment device 40 and base block 30, wherein the seal material 50A has a first connecting surface 51 conforming to the seal specifications of the device side seal surface 44 and a second seal surface 59 conforming to the seal specifications of the block side seal surface 48.


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Inventors:
SUGIYAMA KAZUHIKO
MORIYA SHUJI
Application Number:
JP2000323057A
Publication Date:
May 09, 2002
Filing Date:
October 23, 2000
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F16J15/08; C23C16/44; F16L39/00; F17D1/02; H01L21/00; H01L21/205; (IPC1-7): F16J15/08; F16L39/00; F17D1/02; H01L21/205
Attorney, Agent or Firm:
Tadahiko Ito



 
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