Title:
INTEGRATED PLATING AND PLANARIZATION APPARATUS HAVING COUNTER ELECTRODE WITH VARIABLE DIAMETER
Document Type and Number:
Japanese Patent JP3790758
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an integrated plating and planarization apparatus having a counter electrode with a variable diameter.
SOLUTION: The apparatus for plating and planarizing a metal on a substrate is provided with a plurality of distribution segments each of which has at least one hole for distributing an electroplating solution onto the substrate. The distribution segments form a circular counter electrode and is movable with respect to each other during an electroplating process so that the counter electrode may have a variable diameter. Thus, the electroplating solution is distributed onto the annular part of the substrate having a diameter corresponding to the diameter of the counter electrode. Therefore, the counter electrode can allow the local delivery of the plating solution onto the substrate.
Inventors:
Laetie Economikos
Hariclear Delizani
John M. Cotte
Panayotis Sea Andricacos
Hariclear Delizani
John M. Cotte
Panayotis Sea Andricacos
Application Number:
JP2003348876A
Publication Date:
June 28, 2006
Filing Date:
October 07, 2003
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
C25D7/12; C25D5/04; C25D5/48; C25D17/00; C25D17/12; C25D21/00; C25F3/12; C25F7/00; H01L21/288; (IPC1-7): C25D7/12; C25D5/04; C25D17/00; C25D21/00; C25F3/12; C25F7/00; H01L21/288
Domestic Patent References:
| JP2000208443A |
Foreign References:
| WO1999041434A1 | ||||
| WO2001032362A1 |
Attorney, Agent or Firm:
Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno
Yoshihiro City
Takeshi Ueno