Title:
ウェハボンディングによる電子回路及び光学回路集積
Document Type and Number:
Japanese Patent JP5501768
Kind Code:
B2
Abstract:
One embodiment in accordance with the invention is an apparatus that can include an optical circuit wafer and an integrated circuit wafer. The optical circuit wafer and the integrated circuit wafer are bonded together by a wafer bonding process.
Inventors:
Hartwell Peter
Beausoleil Raymond
Williams Earl Stanley
Stuart Duncan
Beausoleil Raymond
Williams Earl Stanley
Stuart Duncan
Application Number:
JP2009548299A
Publication Date:
May 28, 2014
Filing Date:
January 31, 2008
Export Citation:
Assignee:
Hewlett-Packard Development Company
International Classes:
H01L21/02; G02B6/12; G02B6/42; H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2002118271A | ||||
| JP11307870A | ||||
| JP6097173A | ||||
| JP10170771A | ||||
| JP7283426A |
Attorney, Agent or Firm:
Patent Business Corporation IPS