Title:
インターホン装置、及びインターホンシステム
Document Type and Number:
Japanese Patent JP7437645
Kind Code:
B2
Abstract:
The main phone (41) of the present invention is a residential information board installed in a dwelling unit in an intercom system, and includes a housing (2) having a rectangular opening (22) and a recess (23) provided along at least two sides of a plurality of sides defining the periphery of the opening (22). The main phone (41) further includes a display part (51) overlapped with the opening (22) when viewed from the Y direction, an image display panel (50) disposed inside the housing (2), and a touch panel (20) having a rear surface fixed to the bottom surface of the recess (23). According to this configuration, the touch panel (20) is easily flattened, which is aesthetically pleasing and whose manufacturing cost is easily suppressed. The depth of the recess in the thickness direction is equal to or larger than the thickness of the touch panel. The recess has a first recessed portion and a second recessed portion that is deeper than the first recessed portion in the thickness direction and communicates with the first recessed portion and the opening. The touch panel has a main body and a cover that covers the entire front surface of the main body. When viewed from the thickness direction, the area of the cover is larger than the area of the main body. The housing is provided with one or more holes that are open to the bottom surface of the recess and emit light from a light emitting unit arranged inside the housing. An operation area is provided in an area of the touch panel that overlaps with the recess when viewed from the thickness direction. In addition, the present invention also provides an intercom system comprising an intercom device and one or more information terminals that communicate with the intercom device.
Inventors:
Kumagai Issei
Toshihide Nozoe
Toshihide Nozoe
Application Number:
JP2018190230A
Publication Date:
February 26, 2024
Filing Date:
October 05, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
G06F3/041; H04M1/02; H04M9/00
Domestic Patent References:
| JP2002135686A | ||||
| JP2013225769A | ||||
| JP2004117723A | ||||
| JP2012111688A | ||||
| JP2015106716A | ||||
| JP2013243561A | ||||
| JP201734490A | ||||
| JP2013211725A | ||||
| JP2015204476A |
Foreign References:
| US20120068832 | ||||
| CN207520017U |
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office