INTERMEDIATE BOARD

Japanese Patent JP3034231

B2

PROBLEM TO BE SOLVED: To provide an intermediate board which can be connected to a substrate or a mounting board with high reliability by providing soft metallic bodies having first projecting sections to the main body of the intermediate board with through holes having first surface-side chamfered sections in their first surface-side edge sections in such a state that the first projecting sections are protruded from the first surface of the main body in the thickness direction of the main body.
SOLUTION: An intermediate board 10 has a main body 1. The main body has through holes H formed between its first surface 1a and second surface 1b. The through holes H are arranged on almost the whole surface of the main body 1. The upper part of each through hole H corresponding to about the half thickness of the main body 1 is drilled in a cylindrical shape, but the lower half of the hole H is drilled in a chambered section C2 which is chamfered on the second surface side of the main body 1. A metallic layer 4 composed of a tungsten base metallic layer 2 and an electroless plated Ni-B layer 3 is formed on the internal surface and margin of each through hole H of the main body 1 and a soft metallic body 6 is welded to the plated Ni-B layer 3. Therefore, the reliability of the connection between the intermediate board 10 and a mounting board can be improved and the service life of the board 10 can be prolonged.

Naoki Kito
Koichi Mohri

JP29267097A

April 17, 2000

October 24, 1997

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Nippon Special Ceramics Co., Ltd.

H05K1/18; H01L21/60; H01L23/32; H05K3/24; H05K3/34; H05K3/42; (IPC1-7): H05K1/18; H01L21/60; H01L23/32

JP60123093A
JP281447A
JP7161866A
JP1041606A
JP1012989A
JP1012990A
JP550876B2

Okuda Makoto (3 others)

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