Title:
INTERNAL STRESS MEASURING METHOD OF CRIMP TERMINAL
Document Type and Number:
Japanese Patent JP3825669
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To sensitively measure the internal stress of a crimp terminal.
SOLUTION: A crimp part 2 of the crimp terminal 1 is cut, an X-ray 3 is entered into the cut crimp part 2, and an interatomic distance d1 is measured by the use of a diffracted X-ray 8. After the measurement, the X-ray 3 is entered like the above after a wire in the crimp part 2 is pulled out, and an interatomic distance d2 is measured by the use of the diffracted X-ray 8. Stress σis calculated from those two measurement values d1 and d2. It is preferable that the measurement positions 4 of the crimp part 2 are in the vicinity of the inside wall of the crimp part 2, being the plurality positions separated at predetermined intervals along the circumferential direction of the wire, and being the plurality of positions separated at predetermined intervals along the longitudinal direction of the wire.
More Like This:
WO/2014/076974 | DIFFRACTION RING FORMING DEVICE AND DIFFRACTION RING FORMING SYSTEM |
JPH08219909 | X-RAY STRESS MEASURING APPARATUS |
Inventors:
Mulberry Yamashiro
Application Number:
JP2001315684A
Publication Date:
September 27, 2006
Filing Date:
October 12, 2001
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
G01L1/00; G01L1/25; G01L5/00; (IPC1-7): G01L1/00; G01L1/25; G01L5/00
Domestic Patent References:
JP4125435A | ||||
JP2000213999A | ||||
JP7190868A | ||||
JP2000028442A |
Attorney, Agent or Firm:
Hideo Takino
Hiroshi Ochi
Sadao Matsumura
Isamu Kakiuchi
Hiroshi Ochi
Sadao Matsumura
Isamu Kakiuchi