Title:
サーバ用相互運用可能電力供給モジュール
Document Type and Number:
Japanese Patent JP7340640
Kind Code:
B2
Abstract:
A power delivery module includes a power delivery board rotatable between a first orientation and a second orientation about a first axis that is normal to the power delivery board, and rotatable power clip module. The two pairs of contacts are spaced apart from each other on the same side of the board. The rotatable power clip module is coupled to the power delivery board and includes a pair of contacts pads to engage with, and electrically couple to, the first or the second pairs of contacts. A power clip is electrically coupled to each contact pad. The clip module is rotatable about a second axis parallel to, and spaced apart from, the first axis between a first position, where the contact pads engage the first pair of contacts, and a second position where the contact pads engage the second pair of contacts.
More Like This:
| WO/2021/021201 | COMPUTING DEVICES |
| WO/2021/021137 | ELECTRONIC DEVICE CHASSIS WITH EXPANSION CARD BRACKETS |
Inventors:
High sky wing
Application Number:
JP2022037008A
Publication Date:
September 07, 2023
Filing Date:
March 10, 2022
Export Citation:
Assignee:
Baidu USA LLC
International Classes:
G06F1/18; G06F1/16; H01H19/04; H01H19/08; H05K5/00
Domestic Patent References:
| JP2022068339A | ||||
| JP2018160572A | ||||
| JP2019053700A |
Attorney, Agent or Firm:
Seiichi Inoue
Yusaku Fujita
Yusaku Fujita