Title:
【発明の名称】基板の熱処理方法及び熱処理装置
Document Type and Number:
Japanese Patent JP3102832
Kind Code:
B2
Inventors:
Shinichi Kondo
千葉 ▲隆▼俊
Atsushi Yasue
Mitsukazu Takahashi
Hiroki Kiyama
千葉 ▲隆▼俊
Atsushi Yasue
Mitsukazu Takahashi
Hiroki Kiyama
Application Number:
JP19178894A
Publication Date:
October 23, 2000
Filing Date:
July 21, 1994
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/205; C23C16/44; H01L21/26; (IPC1-7): H01L21/205; C23C16/44; H01L21/26
Domestic Patent References:
| JP61127133A | ||||
| JP1236616A |