ION BEAM MACHINING METHOD, AND WORK THEREBY

Japanese Patent JP3478739

B2

PROBLEM TO BE SOLVED: To shorten the irradiation time of the ion beam, and to reduce the volume of a tapered part of a through-hole in forming the through-hole whose depth is large compared with the area of a machined part by effecting the etching from both face and back sides of a work to form the through-hole.
SOLUTION: A part 41 to be machined of a work 3 is scanned with the ion beam 2 while controlling the part to be machined by the ion optical system. The part 41 to be machined is etched in the depth direction, and a hole 51 is gradually deeper When the depth of the hole 51 is about one half of the thickness of the work 3, the irradiation of the ion beam 2 is stopped once. The work 3 is inverted, and a part 42 to be machined of a back side is scanned with the ion beam 2. The part 42 to be machined is etched in the depth direction, and a hole 52 is gradually deeper to finally form a through-hole 6. The depth of the holes 51, 52 necessary for forming the through the through-hole 6 is about one half of the thickness of the work 3 for each side, the drop in the machining speed is suppressed, the machining time is shortened, and the volume of a tapered part can be reduced to, for example, about 1/3.

WO/2002/072306	METHOD FOR ASSEMBLING A CAMSHAFT
JPS5381451	ELECTRON BEAM IRRADIATION DEVICE AT OUTSIDE OF VACUUM

Toshiaki Kaiba

JP26976798A

December 15, 2003

September 24, 1998

Click for automatic bibliography generation  

Canon Inc

B23K15/00; B23K15/08; C23F4/00; H01J37/305; (IPC1-7): B23K15/00; B23K15/08; C23F4/00; H01J37/305

JP11251210A

Akio Miyazaki (3 others)

Previous Patent: APPLICATOR FOR MAKEUP AND MANUFACTURE THEREOF

Next Patent: PHOTOGRAPHING SYSTEM AND TELEVISION LENS DEVICE