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Title:
イオンビーム処理装置
Document Type and Number:
Japanese Patent JP5195171
Kind Code:
B2
Abstract:

To provide an ion beam treatment device which suppresses a change in incident energy distribution of an ion beam.

The ion beam treatment device includes a plasma chamber for defining a generation space of plasma, a first grid 12 having a plurality of first through-holes 6a, a second grid 14 arranged on an opposite side of the generation space with the first grid 12 formed therebetween and having a plurality of second through-holes 6b for respectively communicating to the plurality of first through-holes 6a, a spacer 2 having projections 52, 54 projecting to both sides so as to fit to a first communicating hole 6A among the plurality of first through-holes 6a and a second communicating hole 6B among the plurality of second through-holes 6b, an extraction electrode 10 facing to the generation space for extracting ions in plasma, and a substrate base facing to the extraction electrode 10 for mounting a substrate to be treated by ions extracted from the generation space.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
Tomoko Ueno
Application Number:
JP2008222076A
Publication Date:
May 08, 2013
Filing Date:
August 29, 2008
Export Citation:
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Assignee:
SHIMADZU CORPORATION
International Classes:
H01J27/02; H01J37/08
Domestic Patent References:
JP8227676A
JP6176890A
JP2247966A
JP62093835A
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Suzuki Isobe