Title:
IPN(INTERPENETRATING POLYMER NETWORK) ADHESIVE, IPN ADHESIVE SHEET AND ADHESION PROCESS
Document Type and Number:
Japanese Patent JP3573109
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive which shows a flexibility and adhesion comparable to those of conventional polyester adhesives and shows a higher heat- resistance compared to that of polyester adhesives.
SOLUTION: The IPN adhesive contains a thermosetting epoxy adhesive component and an energy ray-curing acrylic adhesive component and may form an interpenetrating polymer network. The adhesive shows two peaks in the glass transition temperature after forming an interpenetrating polymer network. The higher glass transition temperature derived from the thermosetting epoxy adhesive component is shifted to a temperature ≥5°C lower than the glass transition temperature of the thermosetting epoxy adhesive component itself.
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Inventors:
Yasuhiro Fujita
Kaori Seki
Tsuneo Hanada
Kaori Seki
Tsuneo Hanada
Application Number:
JP2001188778A
Publication Date:
October 06, 2004
Filing Date:
June 21, 2001
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
C09J7/00; C09J4/00; C09J163/00; (IPC1-7): C09J163/00; C09J4/00; C09J7/00
Domestic Patent References:
| JP8511571A | ||||
| JP7228669A | ||||
| JP10245473A | ||||
| JP11228932A | ||||
| JP10060373A | ||||
| JP8204296A | ||||
| JP10152613A |
Attorney, Agent or Firm:
Noboru Tajime
Tajime Keiko
Tajime Keiko
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