Title:
IRON-NICKEL ALLOY ELECTROPLATING SOLUTION FOR FILLING AND METHOD FOR FILLING APERTURE USING THE SAME, AND METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2018178178
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique whereby an iron-nickel alloy can be utilized in circuit formation by electroplating.SOLUTION: Provided are: an iron-nickel alloy electroplating solution for filling, in which an acetylene alcohol is further contained in the iron-nickel alloy electroplating solution; a method for filling an aperture using the iron-nickel alloy electroplating solution for filling; and a method for producing a circuit board.SELECTED DRAWING: Figure 1
Inventors:
HORI MASAO
HASHIMOTO YASUO
HASHIMOTO YASUO
Application Number:
JP2017076939A
Publication Date:
November 15, 2018
Filing Date:
April 07, 2017
Export Citation:
Assignee:
JCU CORP
International Classes:
C25D3/56; C25D7/00; H05K1/11; H05K3/18; H05K3/40
Attorney, Agent or Firm:
Ono International Patent Office