Title:
JIG
Document Type and Number:
Japanese Patent JP2015121450
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a jig capable of causing a probe to accuracy contact a pad formed on a substrate regardless of outer shape tolerance of the substrate.SOLUTION: Jigs (100-300) comprise: first members (1, 13) on which semiconductor chips (6-8) are mounted, the semiconductor chips having dents (10, 11) for mounting a substrate (63) including thereon pads (61, 81) electrically connected to the semiconductor chips; second members (2, 30) provided on the first members; first fixing members (3, 32) for fixing the second members to the first members; and first probes (4, 12) supported by the second members and supplying a voltage from an external device (9) to the pads. The plurality of first probes are aligned in one direction for one corresponding pad, a distance between the plurality of first probes provided for the one pad is shorter than a length of a side along the alignment direction of the first probes for the corresponding pad.
More Like This:
| JP2002093198 | SEMICONDUCTOR DEVICE |
| JPWO2008114699 | Test equipment and measurement circuit |
| JPS6459170 | TESTING MACHINE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
Inventors:
NAKAJIMA FUMITO
YOSHIMATSU TOSHIHIDE
YOSHIMATSU TOSHIHIDE
Application Number:
JP2013264898A
Publication Date:
July 02, 2015
Filing Date:
December 24, 2013
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
G01R31/28; G01R31/26
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Yuzo Koike
Shigeki Yamakawa
Yuzo Koike