高周波硬化を用いた異種材料の接合 - Didipee Specialty Electronic Materials US, LLC

Title:

高周波硬化を用いた異種材料の接合

Document Type and Number:

Japanese Patent JP2023538730

Kind Code:

A

Abstract:

異なる熱膨張係数を有する基材を、熱硬化性接着剤を用いて接合するための方法が提供される。この方法は、高周波エネルギーを用いる予備硬化ステップ、その後に続く熱硬化ステップを伴う。

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Inventors:

Green, micha
Grüner, Jacob
Bassist, Anirud
Orville, Tyler
Sophia, Daniel
Mastroianni, Sarah

Application Number:

JP2023506020A

Publication Date:

September 11, 2023

Filing Date:

July 13, 2021

Export Citation:

Assignee:

Didipee Specialty Electronic Materials US, LLC

International Classes:

C09J201/00; B62D27/00; C09J5/00; C09J11/04; C09J11/06; C09J163/00

Attorney, Agent or Firm:

Hiroshi Kobayashi
Eiji Katayama
Norio Omori

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