JOINING MATERIAL, JOINING METHOD AND SEMICONDUCTOR EQUIPMENT

Title:

JOINING MATERIAL, JOINING METHOD AND SEMICONDUCTOR EQUIPMENT

Document Type and Number:

Japanese Patent JPH0596395

Kind Code:

A

Abstract:

PURPOSE: To uniformize composition in a joining material for fixing a semiconductor chip to a base material and to shorten the necessary heat treatment time to complete the joining.

CONSTITUTION: Continuous gaps 43 are arranged in a high m.p. soldering layer 41, and by absorbing excess low m.p. soldering layers 42a, 42b into the continuous gaps 45 at the time of wet-spreading the low m.p. soldering layers 42a, 42b into between the semiconductor chip and the base material, the thickness of the low m.p. soldering layers 42a, 42b at between the semiconductor chip and the base material, is thinned and uniformized and much contacting interfaces are formed at between the continuous gaps 43 and the low m.p. soldering layers 42a, 42b and the necessary heat treatment time to diffusion is shortened.

Inventors:

ABE SHUNICHI
NISHINAKA YOSHIRO
FUKUTOME KATSUYUKI
UEDA NAOTO
TAKEUCHI TOSHIO

Application Number:

JP25728291A

Publication Date:

April 20, 1993

Filing Date:

October 04, 1991

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

B23K1/00; B23K35/14; B23K35/22; H01L21/52; H01L23/50; B23K101/40; (IPC1-7): B23K1/00; B23K35/14; B23K35/22; B23K101/40; H01L21/52; H01L23/50

Domestic Patent References:

JPS59169694A	1984-09-25
JPS5321062A	1978-02-27
JPS53100152A	1978-09-01
JPS63168291A	1988-07-12
JPH0347673A	1991-02-28
JPH0242787B2	1990-09-26

Attorney, Agent or Firm:

Mamoru Takada (1 person outside)

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