Title:
JOINING METHOD, JOYNING DEVICE AND JOINING STRUCTURE
Document Type and Number:
Japanese Patent JP3242355
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a joining device capable of reducing excessive working precision in preliminary working of metal plates to be joined, reducing the number of processes in joining, improving workability and ensuring joining strength.
SOLUTION: This joining device is constituted so that a metal plate 2 and a joining member 1 are joined by a aligning through holes 1a, 2a of the joining member 1 formed with a through hole 1a for joining and the metal plate 2 having a through hole 2a smaller than the diameter of the through hole 1a for joining and by deforming at least the through hole 2a of the metal plate 2. In this case, a punch 5 is arranged with a main body part 5a having a diameter larger than the through hole 2a of the metal plate 2 and smaller than the through hole 1a of the joining member 1 as other one of joining objects and a tapered part 5b gradually decreasing its diameter from the main body part 5a toward tip. The punch 5, by thrusting the punch 5 in the through hole 2a of the metal plate 2, the neighborhood of the through hole 2a of the metal plate 2 is deformed, is driven so that the excess stock, which is extruded resulting from the punch 5's thrusting in the through hole 2a of the metal plate 2 is brought into contact with the side face of the through hole 2a of the metal plate 2.
Inventors:
Keiji Ishino
Application Number:
JP23461897A
Publication Date:
December 25, 2001
Filing Date:
August 29, 1997
Export Citation:
Assignee:
株式会社リコー
International Classes:
B21D19/08; B21D39/02; B21D39/03; (IPC1-7): B21D39/03; B21D19/08
Domestic Patent References:
JP4522003B1 |
Attorney, Agent or Firm:
Hideo Takino
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