PURPOSE: To prevent the generation of cracks in a semiconductor package without generating any warping on a lead film as in the case when an insulation film is used by directly dropping an insulation high temperature softening type bonding agent and connecting a semiconductor element with the lead film.

CONSTITUTION: A heated and liquefied or semi-liquefied insulating high temperature softening type bonding agent 21 is adapted to drop on a region where a lead frame will be mounted from a specified elevation. The spots over which the bonding agent 21 is arranged to drop, must include such a location which can be insulated definitely and connected with a generation device to a satisfactory extent in a tab 27. As for other spots, the bonding agent is spot-dropped at the tip of an inner lead 19 as occasion demands. The spot drop method of the bonding agent 21 calls for a spot-drop device capable of dropping bonding agent over the regim where a lead frame will be mounted with accuracy, such as a dispenser type automatic spot-drop device.