Title:
JOINT DEVICE, JOINT SYSTEM, AND JOINT METHOD
Document Type and Number:
Japanese Patent JP2014216496
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent misalignment of a holding part which holds a substrate.SOLUTION: A joint device according to one embodiment includes: a first holding part; a second holding part; a pressurization mechanism; and a holding mechanism. The first holding part includes a first heating mechanism and holds a first substrate. The second holding part is disposed facing the first holding part, has a second heating mechanism, and holds a second substrate. The pressurization mechanism moves the first holding part and the second holding part relative to each other and thereby places the first substrate and the second substrate in contact with each other to pressurize the first substrate and the second substrate. The holding mechanism elastically holds outer peripheral parts of the first holding part and the second holding part.
Inventors:
WADA NORIO
FURUYA GORO
OKAWA OSAMU
FURUYA GORO
OKAWA OSAMU
Application Number:
JP2013092912A
Publication Date:
November 17, 2014
Filing Date:
April 25, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/683; H01L21/02
Domestic Patent References:
| JP2003318097A | 2003-11-07 | |||
| JP2009208084A | 2009-09-17 | |||
| JP2011119293A | 2011-06-16 | |||
| JPH11145264A | 1999-05-28 | |||
| JP2008294099A | 2008-12-04 | |||
| JP2003318097A | 2003-11-07 | |||
| JP2009208084A | 2009-09-17 |
Attorney, Agent or Firm:
Hiroaki Sakai