JUNCTION MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING JUNCTION STRUCTURE

Title:

JUNCTION MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING JUNCTION STRUCTURE

Document Type and Number:

Japanese Patent JP2013176780

Kind Code:

A

Abstract:

To provide junction material which uses material with no lead used and secures high reliability in joining metal plates containing no Ni.

As junction material between two kinds of members, lamination material, which is formed by laminating an Ni metal layer and a Cu metal layer on a surface of a lamination structure material formed of a Zn metal layer, an Al metal layer, and a Cu metal layer, is used as the junction material. Thereby, even in a high oxygen concentration atmosphere, the Cu metal layer on the surface protects Zn, Al, Ni of inner layers from oxidation until when the junction material is molten, and wettability and a junction property of the junction material as solder can be maintained. Furthermore, the contained Ni suppresses reaction between a Cu member of a joined material and Zn, and the high reliability of a junction part can be secured.

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Inventors:

YAMAGUCHI TAKUTO
IKEDA YASUSHI
KURODA HIROMITSU
KUROKI KAZUMA
HATA SHOHEI
ODA YUICHI

Application Number:

JP2012041117A

Publication Date:

September 09, 2013

Filing Date:

February 28, 2012

Export Citation:

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Assignee:

HITACHI CABLE

International Classes:

B23K35/14; B23K1/00; B23K1/20; B23K35/28; C22C18/04; H01L21/52; B23K101/40

Domestic Patent References:

JP2011224598A	2011-11-10
JP2004535931A	2004-12-02

Attorney, Agent or Firm:

Polaire Patent Business Corporation

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