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Title:
JUNCTION STRUCTURE
Document Type and Number:
Japanese Patent JP2020094645
Kind Code:
A
Abstract:
To provide a junction structure which is capable of preventing electro-corrosion in a junction even in a case that adherends are conductive materials each other, and of which the productivity is improved.SOLUTION: The present invention relates to a junction structure in which a first member 10 and a second member 20 that are overlapped are joined by an adhesive 30 interposed therebetween. The junction structure comprises a thickness holding part 2 including a thickness holding element for holding a desired thickness between the first member 10 and the second member 20. The junction structure is characterized in that the thickness holding element includes a flange 41 and a hollow shaft 42 which are electrically insulative. The flange 41 includes a through-hole in a thickness direction, the shaft 42 includes a hollow part in an axial direction, and the through-hole and the hollow part are communicated. The flange 41 is interposed between the first member 10 and the second member 20 and an auxiliary fastening element 50 is inserted into the hollow part. Thus, a thickness between the first member 10 and the second member 20 is held in the desired thickness, and the first member and the second member are being fastened while keeping an insulation property therebetween.SELECTED DRAWING: Figure 5

Inventors:
TAKAHASHI JUMPEI
KAWASHIMA SHIGERU
Application Number:
JP2018233360A
Publication Date:
June 18, 2020
Filing Date:
December 13, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
F16B19/10; B32B3/24; B32B7/12; F16B5/08; F16B11/00



 
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