Title:
KEY PAD ASSEMBLY
Document Type and Number:
Japanese Patent JP2011175981
Kind Code:
A
Abstract:
To provide a keypad assembly configured such that illumination is homogeneous and bright, electric power consumption is reduced, and configuration is simple.
The keypad assembly includes: a light guide plate into which light is propagated its interior; at least one light extracting pattern installed at the light guide plate in order to emit the light propagated into the light guide plate to the exterior of the light guide plate; a switch substrate having at least one switch; and at least one light source in order to couple the light with the interior of the light guide plate. In the keypad assembly, the thickness of the light guide plate is 0.3 to 0.6 mm.
Inventors:
LEE YOU-SEOP
JUNG SUN-TAE
LEE JOO-HOON
JUNG SUN-TAE
LEE JOO-HOON
Application Number:
JP2011123332A
Publication Date:
September 08, 2011
Filing Date:
June 01, 2011
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
G09F13/18; H01H13/02; H01H13/702
Domestic Patent References:
| JP2006324240A | 2006-11-30 | |||
| JP2006318905A | 2006-11-24 | |||
| JP2007053063A | 2007-03-01 | |||
| JP2004069751A | 2004-03-04 |
Attorney, Agent or Firm:
Takashi Watanabe
Shinya Mitsuhiro
Shinya Mitsuhiro