Title:
KIT FOR ADHESION AND ADHESION METHOD
Document Type and Number:
Japanese Patent JP2019026809
Kind Code:
A
Abstract:
To provide means which enables a general consumer and a person engaged in crafts to strongly adhere two members having a small mutual contact area, in particular, plastic members in a short period of time with good appearance, and prevents remaining of tackiness and odor of the adhesive after curing.SOLUTION: A kit for adhesion is provided that includes (A) a specific photocurable resin composition, (B) a heating implement which can heat members to a range of 60-200°C, and (C) an irradiation implement which emits light having a wavelength of 350-400 nm. An adhesion method using the kit for adhesion is also provided.SELECTED DRAWING: Figure 2
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Inventors:
INADA KAZUMASA
Application Number:
JP2017150899A
Publication Date:
February 21, 2019
Filing Date:
August 03, 2017
Export Citation:
Assignee:
TOAGOSEI CO LTD
International Classes:
C09J4/00; C09J5/06; C09J11/06; C09J201/00