Title:
An LED element placement member, an LED element installation board, a manufacturing method for the same, an LED element package, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6183726
Kind Code:
B2
Inventors:
Kazunori Oda
Application Number:
JP2015234852A
Publication Date:
August 23, 2017
Filing Date:
December 01, 2015
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L33/48
Domestic Patent References:
| JP2006173605A | ||||
| JP2008108836A | ||||
| JP2007294621A | ||||
| JP2006310630A | ||||
| JP2009506556A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Takuhisa Murata
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Takuhisa Murata
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