LED-CURABLE MOISTURE-PROOF INSULATION COATING MATERIAL

Japanese Patent JP2018083853

A

PROBLEM TO BE SOLVED: To provide a composition that is a moisture-proof insulation coating material used in a circuit board on which electronic components are mounted, can be cured in a short time even when an irradiating light source is an LED and is excellent in insulation reliability, and has low irritation to skin, and a circuit board insulation treated therewith.SOLUTION: An LED-curable moisture-proof insulation coating material composition that is a photo-curable resin composition including: urethane acrylate (A) that is synthesized from hydrogenated polybutadiene diol and has a number average molecular weight of 1,000 to 20,000; a photopolymerizable monofunctional monomer (B) containing at least noncyclic (meth)acrylamide-based monomer; and an initiator (C) having an absorption band at a wavelength of 380 nm or longer, in which a content of the noncyclic (meth)acrylamide-based monomer is 0.5 to 8% by weight relative to an entire composition, a content of the (C) component is 9 to 15% by weight relative to 100 parts of the entirety of the (A) component and the (B) component, and a packaging circuit board that is insulation-treated therewith.SELECTED DRAWING: None

TASHIRO TOMOJI

JP2016225619A

May 31, 2018

November 21, 2016

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AICA KOGYO CO LTD

C09D4/00; C08F290/04; C09D4/02; C09D5/25; C09D7/40; H01B3/30; H01B3/44

JP2008280414A	2008-11-20
JP2014201593A	2014-10-27
JP2016181370A	2016-10-13

WO2013157624A1	2013-10-24
WO2013118655A1	2013-08-15
CN104093761A	2014-10-08

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