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Title:
LABEL FOR IN-MOLD MOLDING AND PRODUCTION OF IN-MOLD MOLDED ARTICLE USING LABEL
Document Type and Number:
Japanese Patent JPH11198155
Kind Code:
A
Abstract:

To provide a label for in-mold molding good not only in the adhesiveness with a molded article (especially, a cup container by in-mold beads foam molding) but also in the adhesiveness with the outer surface of a base material sheet in an overlapped part at a time of body winding, achieved in cost reduction and capable of effectively suppressing the deposition of contaminant on a mold based on the flow of the printing layer or hot-melt resin layer of the label at the time of molding, and a method for producing an in-mold molded article using the label.

A label 1 is provided on the outer peripheral surface of a molded article simultaneously with the molding of the molded article in a body winding state so that the start end edge and terminal edge of the label generate an overlapped part on the outer peripheral surface of the molded article. This label 1 has such a structure that a solid printing layer 12 is directly provided on the entire surface of the single surface of a base material sheet 11 through a patternwise printing layer 12' and a hot-melt resin layer 13 is provided on the end edge part becoming the overlapped part on a printing layer 12 and the printing layers 12, 12' are constituted of a printing layers of backing printing grade laminate ink.


Inventors:
MITARAI HAJIME
YAMASHITA YUJI
TAKAGI KAZUYA
Application Number:
JP389598A
Publication Date:
July 27, 1999
Filing Date:
January 12, 1998
Export Citation:
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Assignee:
MEIWA PACKS KK
International Classes:
B31D1/02; B29C39/10; B29C67/20; B65C3/26; B65C9/25; B29K105/04; B29L9/00; B29L22/00; (IPC1-7): B29C39/10; B29C67/20; B31D1/02; B65C3/26; B65C9/25
Attorney, Agent or Firm:
Seishi Oishi