積層体、滑り止め舗装構造体及び滑り止め舗装構造体の製造方法 - Mitsubishi Chemical Infratech Corporation

Title:

積層体、滑り止め舗装構造体及び滑り止め舗装構造体の製造方法

Document Type and Number:

Japanese Patent JP7453814

Kind Code:

B2

Abstract:

To provide a laminate for civil engineering and construction such as nonslip pavement structures that can ensure a good retention rate of aggregates.SOLUTION: A laminate includes an acrylic resin layer containing a cured product of a curable resin composition containing a thiol compound (A), a (meth) acrylic polymer or polyfunctional (meth) acrylate (B), monofunctional (meth) acrylate (C), a reducing agent (D), and a curing agent (E), and an epoxy resin layer.SELECTED DRAWING: None

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Inventors:

Hideto Yamazawa
Kazushige Matsumura
Kazuyoshi Shima

Application Number:

JP2020045679A

Publication Date:

March 21, 2024

Filing Date:

March 16, 2020

Export Citation:

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Assignee:

Mitsubishi Chemical Infratech Corporation

International Classes:

E01C11/24; E01C7/35

Domestic Patent References:

JP2015227025A
JP2012241155A
JP2019019307A
JP2020118014A
JP2017115299A

Foreign References:

WO2019004125A1
WO2016171151A1

Attorney, Agent or Firm:

田▲崎▼ 聡
Tetsuya Kimizuka
Onami Kazunori

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