Title:
積層体、硬化性樹脂組成物、積層体の製造方法、接合電極を有する基板の製造方法、半導体装置及び撮像装置
Document Type and Number:
Japanese Patent JP7144624
Kind Code:
B2
Abstract:
The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.
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Inventors:
Taro Shioshima
Kenichiro Sato
Exit Hidehiro
Eisuke Ishizawa
Munehiro Hatakei
Shichiri Tokushige
Kenichiro Sato
Exit Hidehiro
Eisuke Ishizawa
Munehiro Hatakei
Shichiri Tokushige
Application Number:
JP2021552191A
Publication Date:
September 29, 2022
Filing Date:
June 18, 2021
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/02; B32B7/025; C08G77/04; C08G77/44; C08L83/10; H01L21/312; H01L21/60; H01L21/768; H01L23/532; H01L25/065; H01L25/07; H01L25/18; H01L27/146
Domestic Patent References:
| JP2013038112A | ||||
| JP2010116462A |
Foreign References:
| US20160268230 |
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus