To provide a laminated for a heat insulation material excellent in gas barrier property and pinhole resistance in a folded and bent area and generating less outgas, and to provide the vacuum insulation material constituted by capsulating an heat insulation core material into an outer packaging material and degassing the inside of the outer packaging material to make the same a vacuum condition using the laminate in which the outer packaging material is excellent in the gas barrier property, the gas barrier property is less deteriorated with time, the heatseal strength is high, the pinhole resistance is excellent, the generation of pinholes is prevented even though the heatsealed portion is folded and bent, and the heat insulation property is maintained for a long time.
The laminate for the vacuum insulation material is made by laminating a heatsealable resin layer at at least a gas barrier layer and an innermost layer and the heatsealable resin layer is made by laminating a highdensity polyethylene resin, a polyolefin resin, and a highdensity polyethylene resin in series.
COPYRIGHT: (C)2008,JPO&INPIT
| JPS6125837 | NOVEL MULTILAYER STRUCTURE |
| JP7016059 | Surface protection film |
| WO/2023/009679 | HIGH MODULUS, HIGH THERMAL CONDUCTIVITY RADIATIVE PASSIVE COOLANT |
CHUMA TAKAHIRO
IRIE KIYOTAKA
MIKAMI KOICHI
| JP2005163989A | 2005-06-23 | |||
| JP2002225170A | 2002-08-14 | |||
| JPH0825594A | 1996-01-30 | |||
| JP2006027626A | 2006-02-02 | |||
| JP2003326633A | 2003-11-19 |
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
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