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Title:
積層体
Document Type and Number:
Japanese Patent JP6809873
Kind Code:
B2
Abstract:
The invention provides a laminate. Provided are: a photosensitive resin composition which is capable of achieving both the followability of a resist material to a substrate and the suppression of short-circuit defects after an etching process; and a laminate which is provided with the photosensitive resin composition on a base film. The laminate is provided with a base film, and a photosensitive layer of a photosensitive resin composition provided on the base film, the photosensitive resin composition containing (A) an alkali-soluble polymer, a compound containing an ethylenically unsaturated bond, and (C) a photopolymerization initiator, the base film being peelable from the photosensitive layer, and the photosensitive resin composition satisfies the relationship represented by the following mathematical formula (1): WX-DX<=5 [mu]m (1). In the formula, WX and DX are as defined in the description.

Inventors:
Yuri Yamada
Application Number:
JP2016220688A
Publication Date:
January 06, 2021
Filing Date:
November 11, 2016
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/004; B32B7/023; B32B7/06; B32B27/30; C08F2/48; G03F7/027; G03F7/031; G03F7/033; G03F7/16; G03F7/42; H05K3/06; H05K3/18
Domestic Patent References:
JP2009137276A
JP2013210405A
JP5333542A
JP2000075484A
JP9018114A
Foreign References:
WO2015178462A1
US20100037799
WO2014014087A1
WO2014050627A1
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima