PURPOSE: To simply improve adhesive properties of a thin film to a substrate without loss of reflectivity, corrosion resistance, less pinholes by adding indium and indium oxide having satisfactory adhesive properties to metal having easiness to migration and weak adhering strength.

CONSTITUTION: In a laminate in which a thin metal film is laminated on a base by a vapor thin film forming method. In or In2O3 is added to the thin metal film. The metal for forming the thin metal film includes, for example, metals such as Au, Ag, Pd, Pt, Ni, Rh, Bi, Zn, Cu, Cd, Al, Sn, Pb or their alloys. A point of less pinholes is advantageous. It is particularly effective for noble metal having easy migration such as Au, Pt, Pd, etc. desired to improve deterioration of adherence to the base. A method of forming the thin metal film is not particularly limited it if is the vapor thin film forming method, and, in addition to a sputtering method, conventional vapor thin film forming method such as a vacuum depositing method, an ion beam depositing method, an EB depositing method, an ECR method, etc., may be applied.