Title:
合わせ板、および合わせ板の製造方法
Document Type and Number:
Japanese Patent JP6540386
Kind Code:
B2
Abstract:
A laminated plate includes a first plate; a second plate; and an intermediate film for bonding the first plate and the second plate, wherein the first plate includes a first main surface arranged at a side opposite to the intermediate film, and a second main surface that contacts the intermediate film, wherein the second plate has a third main surface that contacts the intermediate film, and a fourth main surface arranged at a side opposite to the intermediate film, wherein, upon the bonding by the intermediate film being released, a radius of curvature of the second main surface is smaller than that of the third main surface both in a transverse section and in a longitudinal section, and wherein a maximum value of bending compressive stress at an outer peripheral portion of the fourth main surface is less than or equal to 100 MPa.
Inventors:
Keiji Nozu
Fixed price
Makoto Narita
Jiro Nishihama
Fixed price
Makoto Narita
Jiro Nishihama
Application Number:
JP2015171393A
Publication Date:
July 10, 2019
Filing Date:
August 31, 2015
Export Citation:
Assignee:
AGC Inc.
International Classes:
C03C27/12; C03B23/023
Domestic Patent References:
| JP3059337U | ||||
| JP2014527011A | ||||
| JP2003505287A | ||||
| JP2005529828A | ||||
| JP54100415A | ||||
| JP2007197288A | ||||
| JP2013525235A | ||||
| JP11011989A |
Foreign References:
| WO2004035492A1 | ||||
| WO2014029605A1 | ||||
| WO2011096447A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito