PURPOSE: To obtain a laminated board being employed in the production of a printed wiring board and the like excellent in solder heat resistance, adhesion to metal, chemical resistance, waterproofness, flexibility, etc.

CONSTITUTION: An insulation layer and a conductive metal layer are laminated on a supporting board provided with a group of conductive bumps at a predetermined position. The group of conductive bumps penetrates the insulation layer in the direction of thickness and connected with the conductive metal layer. The insulation layer is composed of a polymeric compound having optically anisotropic fusion layer and electric connection is ensured by bumping method.