Title:
接合用積層体、２つの被着体を接合する方法、及び、接合構造体の製造方法
Document Type and Number:
Japanese Patent JP6674594
Kind Code:
B2
Abstract:
The present invention relates to: a layered product for bonding which comprises, in the following order, a molecular-adhesive layer comprising a specific molecular adhesive (M), a first thermoplastic resin layer, which comprises a specific thermoplastic resin, and a second thermoplastic resin layer, the molecular-adhesive layer and the second thermoplastic resin layer serving as the outermost layers at the time of use, wherein, when the heat-sealable temperature of the first thermoplastic resin layer is expressed by Th1 and that of the second thermoplastic resin layer is expressed by Th2, then Th1>Th2; a method for bonding two adherends with this layered product for bonding; and a method for producing a bonded structure. Use of the layered product for bonding of the present invention makes it possible to conduct a thermal fusion-bonding step without adversely affecting the molecular-adhesive layer.
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Inventors:
Kazue Uemura
Takeshi Miyata
Takeshi Miyata
Application Number:
JP2019570142A
Publication Date:
April 01, 2020
Filing Date:
March 28, 2019
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C09J7/35; B29C65/02; B29C65/52; B32B27/00; B32B27/08; C09J5/06; C09J7/22; C09J7/29; C09J201/02; C09J201/10
Domestic Patent References:
| JP11048423A | ||||
| JP2008050541A |
Foreign References:
| WO2007029541A1 |
Attorney, Agent or Firm:
Haruhito Oishi