To provide normal mounting directivity, to eliminate a solder fillet projected to the side part of a component main body, to set a loading interval for mutually adjacent electronic components narrow and to perform high density mounting, capable of more effective utilization of the area of the limited plate surface of a circuit board.
An electronic component main body 1 is formed by alternately laminating internal electrodes 2, 2', and so on and a dielectric layer and the parts 2a, 2b, 2a' and 2b' of the end faces of the internal electrodes 2 and 2' which are not electrically connected to each other are separately exposed within respective surfaces near both end parts of the component main body 1 which is parallel to the end faces. External connection electrodes 3a, 3b, 4a and 4b electrically connected to the parts 2a, 2b, 2a' and 2b' of the end faces of the internal electrodes 2 and 2', while keeping a distance within the respective surfaces from the outer peripheral edge of the component main body 1, are provided respectively in the same form on the respective upper and lower surfaces of the component main body 1.
ISHIGAKI TAKAYA
SATO HIROKI
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