To provide a circuit material which has small reflection or radiation even at ultrahigh frequency or ultrahigh speed signal transmission since a characteristic impedance can be made small with low loss.

A laminated circuit material includes a conductor layer configured with an atomic layer made of a single element with a single layer or a plurality of layers, and a restricted layer in which the atomic layer made of a single or a plurality of elements forms a more stable bond than an interatomic bond between the elements for constituting the conductor layer. A method of reducing the electrical resistance of the circuit material includes a step of laminating the atoms of the conductor layer and the restricted layer in an atomic alignment state (hetero structure).