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Title:
積層フィルムの連結装置およびそれを用いた連結方法
Document Type and Number:
Japanese Patent JP4037639
Kind Code:
B2
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Inventors:
Katsunori Futase
Application Number:
JP2001346377A
Publication Date:
January 23, 2008
Filing Date:
November 12, 2001
Export Citation:
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Assignee:
Taisei Lamick Co., Ltd.
International Classes:
B65B41/12
Domestic Patent References:
JP8113213A
JP3335615B2
JP8026221A
Attorney, Agent or Firm:
Junzo Ogawa
Morio Nakamura



 
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