Title:
LAMINATED FILM AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2022006733
Kind Code:
A
Abstract:
To provide a laminated film that can be used for applications such as sealing films in electronic devices, the laminated film being capable of achieving good bonding without causing problems such as mixing of air bubbles during bonding and also achieving bonding with high durability, and a manufacturing method of an electronic device, capable of performing such manufacturing.SOLUTION: A laminated film for sealing in an electronic device includes an adhesive layer (A) and an adhesive layer (B) laminated on the adhesive layer (A). The storage elastic modulus E(A25) at 25°C of the adhesive layer (A) and the storage elastic modulus E(B25) at 25°C of the adhesive layer (B) each are 0.5 MPa or more, and E(B25)≤E(A25)/4 is satisfied. A manufacturing method of an electronic device includes: arranging the laminated film on the surface of an electronic device component to be sealed; heating and pressing the laminated film; and sealing the surface of the electronic device component.SELECTED DRAWING: None
Inventors:
INOUE HIROYASU
Application Number:
JP2020109145A
Publication Date:
January 13, 2022
Filing Date:
June 24, 2020
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
H01L23/29; B32B27/00; C09J7/30; C09J11/04; C09J11/06; C09J11/08; C09J201/10; H01L21/56; H01L51/50; H05B33/04; H05B33/10
Attorney, Agent or Firm:
Sakai International Patent Office
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