Title:
LAMINATED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5887861
Kind Code:
A
Abstract:
PURPOSE: To obtain the laminated semiconductor device of high reliability by a method wherein the transfer of information between each element of said semiconductor device is performed by means of an optical communication.
CONSTITUTION: The information of element layers 2, 4 and 6 is transmitted or received and then transferred by a transmission-reception section 8 using infrared rays, for example, which passes through the element layers 2, 4 and interlayer insulating layers 3 and 5. The transmission and reception part may be located at the same place or located separately.
Inventors:
MATSUKAWA TAKAYUKI
KOTANI HIDEO
YAMANO TAKESHI
KOTANI HIDEO
YAMANO TAKESHI
Application Number:
JP18729081A
Publication Date:
May 25, 1983
Filing Date:
November 19, 1981
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K7/02; H01L27/00; H01L27/06; (IPC1-7): H01L27/12; H01L31/12
Attorney, Agent or Firm:
Masuo Oiwa