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Title:
LAMINATED SUBSTRATE
Document Type and Number:
Japanese Patent JP3646410
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To eliminate the fixation of a metal layer to a substrate under pressure at high temperature by a method wherein a composition, which is prepared by dissolving a polymer component consisting of non-crystalline polyimide siloxane and aromatic epoxy compound in organic solvent, is applied onto the substrate so as to paste the metal layer to the board at the lamination of the metal layer to the substrate through adhesive.
SOLUTION: At the manufacturing of a laminated substrate such as one represented by the flexible substrate of a tape of TAB, a composition, which is prepared by dissolving a polymer component consisting of non-crystalline polyimide siloxane having a functional group reacting with an epoxy group in a benzene ring and an aromatic epoxy compound in organic solvent, is applied onto a laminated substrate and, after the solvent is removed through evaporation, the metal layer is pasted to the bonding surface of the substrate under heat and pressure. At this case as the functional group reactive with the epoxy group of the non-crystalline polyimide siloxane, an OH group or a COOH group is employed. Further, the adhesive is prepared from the reactive mixture of 100 pts.wt. of the non-crystalline polyimide siloxane and 1-50 pts.wt. of epoxy resin.


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Inventors:
Seiji Ishikawa
Hiroshi Yasuno
Application Number:
JP15652896A
Publication Date:
May 11, 2005
Filing Date:
June 18, 1996
Export Citation:
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Assignee:
Ube Industries,Ltd.
International Classes:
C08J5/12; B32B15/08; B32B15/088; C08G59/40; C08G73/10; C08L63/00; C09J163/00; C09J179/08; H05K3/38; (IPC1-7): B32B15/08; C08G59/40; C08G73/10; C09J163/00; C09J179/08
Domestic Patent References:
JP7154042A
JP6200216A



 
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