Title:
LAMINATED THIN FILM CAPACITOR
Document Type and Number:
Japanese Patent JPH05109578
Kind Code:
A
Abstract:
PURPOSE: To solve a subject of obtaining no desirable solderability and to provide a laminated thin film capacitor having excellent solderability in the capacitor to be used for an electronic apparatus, etc.
CONSTITUTION: The laminated thin film capacitor comprises a capacitor element 4 in which inner electrodes 2 and thin film dielectric layers 3 are alternately laminated on one or both side surfaces of an insulating board 1, frame sprayed metal layers 6 formed on both end faces of the element 4 by a plasma flame spraying method, intermediate nickel-plated layers 7 formed 0.5μm thick on the layers 6, and solder-plated layers 8 formed 2μm thick on the layers 7. Thus, satisfactory solderability having excellent reliability can be obtained.
Inventors:
SAKATA YOSHIHIRO
KONDO TOSHIFUMI
HAGA MIKIO
KUME NOBUYUKI
UDA YOSHITO
IKEGAMI SEIJI
KONDO TOSHIFUMI
HAGA MIKIO
KUME NOBUYUKI
UDA YOSHITO
IKEGAMI SEIJI
Application Number:
JP27081291A
Publication Date:
April 30, 1993
Filing Date:
October 18, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
KYOWA ELECTRIC WIRE
KYOWA ELECTRIC WIRE
International Classes:
H01G4/232; H01G4/06; H01G4/30; H01G4/33; (IPC1-7): H01G1/147; H01G4/06; H01G4/30
Attorney, Agent or Firm:
Akira Kobiji (2 outside)